JPH01100438U - - Google Patents
Info
- Publication number
- JPH01100438U JPH01100438U JP19559387U JP19559387U JPH01100438U JP H01100438 U JPH01100438 U JP H01100438U JP 19559387 U JP19559387 U JP 19559387U JP 19559387 U JP19559387 U JP 19559387U JP H01100438 U JPH01100438 U JP H01100438U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- bonding
- groove
- manufacturing apparatus
- island portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19559387U JPH01100438U (en]) | 1987-12-22 | 1987-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19559387U JPH01100438U (en]) | 1987-12-22 | 1987-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01100438U true JPH01100438U (en]) | 1989-07-05 |
Family
ID=31486265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19559387U Pending JPH01100438U (en]) | 1987-12-22 | 1987-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01100438U (en]) |
-
1987
- 1987-12-22 JP JP19559387U patent/JPH01100438U/ja active Pending